ATV-TCB
PROGRAMMABLE OVEN WITH INFLATABLE MEMBRANE FOR THERMO COMPRESSION BONDING APPLICATION

Quick look at: ATV-TCB
PROGRAMMABLE OVEN WITH INFLATABLE MEMBRANE FOR THERMO COMPRESSION BONDING APPLICATION

ATV’s successful SRO-71X series IR vacuum reflow oven is the heart of ATV’s reflow soldering principle. Our ATV-TCB, Thermal Compression Bonding is also based on which this system is developed. The Single Cold Wall Process Chamber approach is a standard on itself and is also applied for the ATV-TCB which fulfills all your process requirements.

Our Thermal Compression Bonding system has an isostatic press in combination with an elastomer membrane. This patented technology gives you the opportunity to use a maximum pressing force of 0,5MPa over 150 mm Ø. This pressure can be gradually built up to the desired process pressure under which you want to perform your process. With our applied membrane technology you will not be faced with product shifting from start to finish. Another advantage for our technology is that you may process simultaneously products which have a different topography. This will have no influence on the expected final process results.    

Also in this tool ATV uses all its know-how of the cold wall technology in combination with the IR heating concept, vacuum assembly as well as formic acid atmosphere to achieve the prefect solder joints you need for a reliable product. Working with the ATV-TCB you will notice that programming is easy and with the 100 step programming steps you will be able to fine tune your process in such a way that a process success is guaranteed.

It is ATV’s goal to always reach the market best soldering results using its proven single Chamber Process concept as its core competence for over 30 years.

Facts ATV-TCB
Technical information and figures

Technical Data ATV-TCB

depending on system configuration

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Footprint:     

760mm x 960mm x 1800mm

Weight: 

240 kg (minimum configuration)

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Working Height:

950 – 1080mm adjustable

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Distance membrane above heated plate:

Up to 12mm for the pressing unit

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​Heated Area:    

Ø160mm for the bonder configuration

Chamber Lid Open/Closing:    

Automatic lid closing/opening and locking/unlocking

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Heating Method:   

PID controlled IR lamp array heating principle of heated plate

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Cooling:

Cold wall technology

PID controlled cooling with nitrogen up to 800slm

Common Applications ATV-TCB

depending on system configuration

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Transient Liquid Phase Soldering/Bonding

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Cu pillar/micro bump flip chip soldering

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Low pressure silver sintering

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Micro Peltier/TEC Soldering/Bonding

Features ATV-TCB

depending on system configuration/optionals

Viewing window

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Membrane assembly ≤ 5 bar gas pressure

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100 steps/recipe.

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Low temperature bonding KIT (260°C max., pre-installed) :

               incl. FKM standard membrane and SiSiC heating plate,
               Temperature homogeneity SiSiC heating plate: ±2.3% over 85% of the working surface

High temperature bonding KIT (300°C max., pre-installed):

               incl. FFKM high-performance membrane and R-SiC heating plate.
              Temperature homogeneity R-SiC heating plate: ±1.5% over 85% of the working surface

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Maximum temperature depending on the membrane used:

               260°C (FKM standard) / 300°C (FFKM high performance), factory-set limited to 300°C

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Formic Acid supply Assembly

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