Quick look at: SRO-71X-TCB
PROGRAMMABLE OVEN WITH INFLATABLE MEMBRANE FOR THERMO COMPRESSION BONDING APPLICATION
ATV’s successful SRO-71X series IR vacuum reflow oven is the heart of ATV’s reflow soldering principle. Our SRO-71X-TCB, Thermal Compression Bonding is also based on which this system is developed. The Single Cold Wall Process Chamber approach is a standard on itself and is also applied for the SRO-71X-TCB which fulfills all your process requirements.
Our Thermal Compression Bonding system has an isostatic press in combination with an elastomer membrane. This patented technology gives you the opportunity to use a maximum pressing force of 0,5MPa over 150 mm Ø. This pressure can be gradually built up to the desired process pressure under which you want to perform your process. With our applied membrane technology you will not be faced with product shifting from start to finish. Another advantage for our technology is that you may process simultaneously products which have a different topography. This will have no influence on the expected final process results.
Also in this tool ATV uses all its know-how of the cold wall technology in combination with the IR heating concept, vacuum assembly as well as formic acid atmosphere to achieve the prefect solder joints you need for a reliable product. Working with the SRO-71X-TCB you will notice that programming is easy and with the 100 step programming steps you will be able to fine tune your process in such a way that a process success is guaranteed.
It is ATV’s goal to always reach the market best soldering results using its proven single Chamber Process concept as its core competence for over 30 years.
Technical information and figures
Technical Data SRO-TCB
740mm x 990mm x 1800mm
240 kg (options depending)
950 – 1050mm adjustable
up to 100mm
217 x 227mm; Ø160mm for the bonder configuration
Chamber Lid Open/Closing:
Automatic lid closing/opening and locking/unlocking
PID controlled IR lamp array heating principle of heated plate
2; PID controlled
Cooling water supply:
Cold wall technology
Inlet max. 4 bar; diff. pressure min. 2 bar
3 x 400 VAC, 32 A, 19kW, 50-60 Hz,
TN-C-S (other power options available)
Common Applications SRO-TCB
Transient Liquid Phase Soldering/Bonding
Cu pillar/micro bump flip chip soldering
Low pressure silver sintering
Micro Peltier/TEC Soldering/Bonding
Membrane assembly ≤ 5 bar gas pressure
PLC based controls:
100 steps/recipe, Step length up to 99 min.
Cooling rate: min.:
25°C/minute from T.max. down to 60°C
450°C permanent (standard config.)
300°C permanent (bonder config.)
Oxygen < 1,0ppm
Formic Acid supply Assembly
Two Gas supply connections
Various vacuum pumps
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