SRO-716 P40 (7)
SRO-714/716
SRO-714/716
SRO-714/716
SRO-714/716

Quick look at: SRO-714/SRO-716

IR VACUUM REFLOW SYSTEM

With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and SRO-716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements. 

 

The Solder Reflow Ovens SRO-714 and  SRO-716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid.

 

Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and SRO-716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or SRO-716 our 100-Step-Recipe will make programming easy and guarantee superb process results. 

 

Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and SRO-716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.

 

Facts SRO-714/SRO-716

Technical information and figures

(depending on system configuration)

Technical Data SRO-714/SRO-716

depending on system configuration

Footprint:     

960 x 760 x 1800mm  (LxWxH) 

 

Weight: 

240kg. (minimum configuration)

Chamber Height: 

up-to 100mm

Heated Area:    

SRO-714              230 x 217mm

SRO-716              314 x 314mm

Chamber Lid Open/Closing:    

Manual

Heating Method:   

SRO-714 IR         ( 8pcs. Lamp Array)

SRO-716 IR         (12pcs. Lamp Array)

Heating Zones:

SRO-714              2

SRO-716              3

Common Applications SRO-714/SRO-716

depending on system configuration

  

IGBT/DBC

Power Semiconductors

Sensors/IR Bolometer Detector

MEMS Devices

DIE Attachment

High Power LED

Hybrid Assembly

Flip Chip

Package Sealing

MMICs

Transient liquid phase soldering/bonding

Ag sintering

Thermo compression bonding

CPV, Laser bar

Features SRO-714/SRO-716

depending on system configuration/optionals

 

Flux-less, Solder Paste and Flux (optional configuration)

 

Direct IR Heating

Surface touch TC

Multiple TC monitoring

Exchangeable Ceramic Heater Plate

Process temperature 450°C up to 750°C (optional configuration)

Oxygen = N2 supply quality

100 steps/programm

 

Options SRO-714/SRO-716

Additional values depending on application and final configuration

Spring pin array (in chamber lid)

Custom tailored substrate fixture

Flux management

Flux and solder paste

300 kPa

Top heater

Lift pins 

Formic acid enriched atmosphere

low vacuum, fine vacuum, high vacuum

Gas plasma atmosphere

H2O / O2 analyzing

RGA/Mass spectrometer

 

Fill out the form and our latest SRO-714/SRO-716 information will be sent to you by e-mail.

Fields marked with an * are mandatory.

Downloads

Documents "to go"