SRO-700

TABLE TOP – IR VACUUM REFLOW SYSTEM

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Quick look at: SRO-700

TABLE TOP – IR VACUUM REFLOW SYSTEM

Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic process requirements.

 

And this table top soldering system is the ideal tool for R&D applications as well. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

 

With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. Whether using flux, flux less or solder paste the SRO-700 is an incredibly versatile reflow oven for every thinkable semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.

 

Just imagine creating a flux less process via a formic acid atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption the SRO-700 is prepared for the latest generation of flux based solder pastes which depend on low oxygen content during the process run.

 

Facts SRO-700

Technical information and figures

Technical Data SRO-700

Footprint:     

770 x 560 x 800mm (LxWxH)

 

Weight: 

65 kg (options depending)

Chamber Height: 

100mm

Heated Area:    

230 x 217mm

Chamber Lid Open/Closing:    

Manual

IR Heating:    

Array of 8 IR lamps in Quartz glass tubes (2 Heating zones)

Power connection:    

3Ph-N-PE 230/400V, 50/60Hz

Power:    

6,5 kW

Common Applications SRO-700

  

IGBT/DBC

Power Semiconductors

Sensors

MEMS Devices

DIE Attachment

High Power LED

Hybrid Assembly

Flip Chip

Package Sealing

Features SRO-700

  

FORMIC ACID ENRICHED ATMOSPHERE

Direct IR Heating

Multiple TC monitoring

Process temperature 450°C up to 700°C

Temperature ramp-up rate 3,5K/sec.

Temperature cool-down rate 2K/sec.

Rapid single wafer processing < 20°C/sec.

Oxygen < 1,0ppm with PURIFIED N2

100 steps/RECIPE program

 

Options SRO-700

Additional values

Spring Pin Array (in chamber lid)

Custom tailored substrate fixture

Graphite heater plate

Spring clamps on hot plate

Lid Lock

KF40/CF63 port on chamber lid

Diaphragm/Scroll/turbo pump < 5 x 10¯⁵ mbar

Closed loop water chiller/heater

 

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ATV-Technologie GmbH

Entwicklung und Vertrieb von Maschinen und Geräten für die Mikroelektronik

info {at} atv-tech.de

Johann-Sebastian-Bach-Str. 38

85591 Vaterstetten

Germany

Phone: +49 (0)8106-3050-0

Fax: +49 (0)8106-3050-99