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Quick look at: RV-129
RV Diamond Scriber
Precision diamond scriber for manual scribing with 8"-Ø, vacuum, chuck, fine adjustable in X-and Ø- digital gauge for X resolution 10µm, cross hair microscope lined up with the scribe trace to use it as a reference for further scribes. max. scribe length 220 mm, max. X travel 190 mm.
This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous. All essential operating parameters - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal felxibility and repeatable results.
For fast and easy scribing of ceramics, glass, silicon, GaAs, InP and many more
Facts RV-129
Technical information and figures
Technical Data RV-129
depending on system configuration
Max. Cutting length/width:
200mm / 100mm
Dimensions:
500 x 500 x 300mm
Weight:
25kg (minimum configuration)
Common Applications RV-129
depending on system configuration
Ceramics
Glass
Silicon
GaAs
InP
Features RV-129
depending on system configuration
Rotating vacuum Chuck for maximum 1 x 200mm wafer
4 Notches for 90° snap into position
Mounted on X/Y stage with linear bearings
Adjustable mounting positions to vary scribing angle
Angle adjustment via micrometer
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Min. Resolution: 0,006°
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Max. Resolution: 4°
Micro meter adjustment for scribing height and X positioning to match the Y line
X-Axis max. Range ≤ 240mm, resolution 10 μm with digital gauge
Y-Axis max. Range ≤ 240mm scribing length
Substrate thickness ≤ 10mm
Adjustable touch-down/lift up diamond tool Y position setting scribing length
Diamond tool with 4 cutting edges
Scribing pressure: 5 581gr. (positioning weights on balance scale)
Monocular microscope with reticle (100 increments)
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40X
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Resolution of scale reticle: ½ increments ≤ 8 μm
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LED Illumination
Options RV-129
Additional values
Vacuum pump for substrate/wafer clamping and Z-Axis diamond tool movement
Vacuum chuck for wafers fragments down to 5 x 5mm
Digital Camera