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Here you find Publications of processes by ATV and Publications where ATV Equipment is used.
Zero Shrinkage of LTCC by Self-Constrained Sintering
In situ shrinkage measurement during pressure-assisted sintering of low temperature co-fired ceramic panels
Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing
Growth optimisation of high quality graphene from ethene at low temperatures
Investigation of solder bumps flip chip assembly reliability and passive alignment using Au/Sn
Experiences in flip chip production of radiation detectors
Flip Chip Hybridization of Pixel
Detectors for the ALICE and LHCb
