ATV Technologie GmbH

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Publications

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ATV Solutions – Publications

Here you find Publications of processes by ATV and Publications where ATV Equipment is used.

LTCC Sintering

Zero Shrinkage of LTCC by Self-Constrained Sintering

LTCC Sintering

In situ shrinkage measurement during pressure-assisted sintering of low temperature co-fired ceramic panels

LTCC hot embossing

Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing

Graphene CVD

Growth optimisation of high quality graphene from ethene at low temperatures

SRO Bump Reflow

Investigation of solder bumps flip chip assembly reliability and passive alignment using Au/Sn

SRO Bump Reflow

Experiences in flip chip production of radiation detectors

SRO Bump Reflow

Flip Chip Hybridization of Pixel

Detectors for the ALICE and LHCb