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    Publications

    see Links below

    ATV Solutions – Publications

     

    Here you find Publications of processes by ATV and Publications where ATV Equipment is used.

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    LTCC Sintering

    Zero Shrinkage of LTCC by Self-Constrained Sintering

    LTCC Sintering

    In situ shrinkage measurement during pressure-assisted sintering of low temperature co-fired ceramic panels

    LTCC hot embossing

    Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing

    Graphene CVD

    Growth optimisation of high quality graphene from ethene at low temperatures

    SRO Bump Reflow

    Investigation of solder bumps flip chip assembly reliability and passive alignment using Au/Sn

    SRO Bump Reflow

    Experiences in flip chip production of radiation detectors

    SRO Bump Reflow

    Flip Chip Hybridization of Pixel

    Detectors for the ALICE and LHCb

    ATV-Technologie GmbH

    Entwicklung und Vertrieb von Maschinen und Geräten für die Mikroelektronik

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