ATV PRODUCTS
REFLOW SOLDERING
SRO i-LINE VACUUM REFLOW SOLDERING SYSTEM FOR MASS PRODUCTION
HIGH VOLUME PRODUCTION
The SRO-i-Line sets new standards in high-volume production and combines maximum efficiency with excellent process control. Thanks to its compact design and the ability to integrate up to three process chambers, the SRO-i-Line maximizes your production capacity without requiring additional space. This ensures maximum flexibility and efficient use of your production area. The short cycle times and advanced vacuum soldering technology mean that even the most demanding applications in the microelectronics and semiconductor industries can be handled effortlessly. The powerful IR heating technology ensures excellent temperature homogeneity across the entire work surface, while the integrated formic acid system guarantees optimum wetting and ensures void-free solder joints. A vacuum of less than 1 mbar and an oxygen content of less than 1 ppm can be reached with purified nitrogen to create perfect process conditions for sensitive components. A decisive advantage is the extremely high flexibility: The SRO-i-Line enables both heating via heating plates and direct component heating. This means that even complex component geometries, such as products with integrated cooling channels, can be processed reliably. Maintenance has also been optimized to avoid production downtimes. In a configuration with three process chambers, two chambers can continue to run while one is being serviced – keeping production always running. Whether as a standalone semi-automatic version or as a fully integrated solution in an automated production line – the SRO-i-Line offers a future-proof, powerful and reliable solution for demanding soldering processes. More throughput, less waste and maximum process reliability – the SRO-i-Line gives you a real advantage.
Facts & Options about our SRO i-Line Vacuum Reflow Soldering System for Mass Production
HIGHLIGHTS SRO i-Line
- High Capacity:
- Up to 3 process chambers
- Short cycle times
- Efficent throughput
- Uniform heating
- Advanced IR technology
- Excellent temperature uniformity
- Oxygen < 1.0 ppm with purified N2
- Small footprint
- No footprint change up to 3 Process Chambers
- Low Maintenance
- Two process chambers can operate while one is being serviced, minimizing downtime and ensuring continuous production
COMMON APPLICATIONS SRO i-Line
- IGBT / DBC
- Power Semiconductors
- Sensors
- MEMS Devices
- DIE Attachment
- High Power LED
- Hybrid Assembly
- Flip Chip
- Package Sealing
TECHNICAL DATA SRO i-Line
depending on system configuration/optionals
- Dimensions
- 1825 x 1740 x 2645 mm (including status light)
- Weight
- Maximum 1400 kg (with 3 chambers)
- Maximum Product Height
- up to 50 mm
- Carrier Dimensions
- 410 x 445 mm
- Heating Method
- Array of 18 IR lamps per chamber
- Temperature
- Process temperature up to 450°C
- Vaccum Level
- 10-1 mbar
- Power Connection
- Peak power consumption 65 kW
OPTIONS SRO i-Line
- Additional Process Chambers
- Flux Management
- Substrate Fixture
