ATV PRODUCTS
REFLOW SOLDERING
SRO-700 VACUUM REFLOW SOLDERING SYSTEM
TABLE TOP – IR VACUUM REFLOW SYSTEM FOR R&D PURPOSES
The SRO-700 vacuum reflow soldering system is an ideal solution for semiconductor and MEMS applications, , offering 100mm clearance over the heated surface. It can be used for reflow soldering processes, making it a valuable tool for R&D environments. The cold wall chamber principle supports effective thermal management, while the IR lamp heating technology provides consistent heat distribution. The SRO-700 also includes vacuum capabilities and formic acid processes, helping to achieve void-free solder joints and reliable process repeatability.
Facts & Options about our SRO-700 Vacuum Reflow Soldering System
HIGHLIGHTS SRO-700
- Formic Acid Enriched Atmosphere
- Direct IR Heating
- Multiple TC monitoring
- Process temperature 450°C
- Oxygen < 1.0 ppm with purified N2
- 100 steps / recipe program
COMMON APPLICATIONS SRO-700
- IGBT / DBC
- Power Semiconductors
- Sensors
- MEMS Devices
- DIE Attachment
- High Power LED
- Hybrid Assembly
- Flip Chip
- Package Sealing
TECHNICAL DATA SRO-700
depending on system configuration/optionals
- Footprint
- 560 x 800 x 770mm (LxWxH)
- Weight
- 85kg (minimum configuration)
- ChamberHeight
- 96mm
- Heated Area
- 230 x 217mm
- Chamber Lid Open/Closing
- Manual
- IR Heating
- Array of 8 IR lamps in Quartz glass tubes (2 heating zones)
OPTIONS SRO-700
- Fine Vacuum
- High Vacuum
- Closed loop water chiller/heater
