Processes

ATV Solutions – Process Based

Discover the latest technological achievements for vacuum reflow systems at ATV Technologie.

Choose from our unique solutions by process or application.

Click on the link to get detailed information on every single product.

Vacuum Soft Soldering / Reflow

Formic acid
Inert / noble gas
Solder paste / flux management
H2, N2H2 safety feature
Positive pressure: 0,3 Mpa

Thermal Oxidation / Annealing

Wet/dry oxidation
High vacuum
H2 atmosphere
Inert / noble / reactive gas
5 tunable heater zones

Thermo Compression Bonding up to 300°C

Transient liquide phase soldering
Ag sintering
Cu pillar soldering

Vacuum Brazing

Glass sealing
High temperature alloys
N2 atmosphere
H2 atmosphere
High vacuum
Rapid thermal brazing/sealing

Thick film conductor paste firing

Pt, Au, AgPd
Ag paste / ink firing
Resistor paste
Dielectric / glass paste
Thick copper conductor paste
Dry clean air / N2 atmosphere

High Vacuum Enclosing

Package sealing with high vacuum encapsulation
MEMS Cap / package lid sealing
Micro bolometers
IR detectors
Gyroscopes
Thermal getter activation