Process Solutions
by production process
ATV Solutions – Process Based
Discover the latest technological achievements for vacuum reflow systems at ATV Technologie.
Choose from our unique solutions by process or application.
Click on the link to get detailed information on every single product.
Vacuum Soft Soldering/Reflow
formic acid
inert/noble gas
solder paste/flux managment
H2, N2H2 safety feature
ArH2 plasma
positive pressure: 0,3 Mpa
Vacuum Soft Soldering/Reflow
high vacuum
low vacuum
double side heating
up to 1000°C
single wafer processing
lift pins
feed through
Thick film conductor paste firing
Pt, Au, AgPd
Ag paste/ink firing
resistor paste
dielectric/glass paste
thick copper conductor paste
dry clean air/N2 atmosphere
Vacuum Brazing
glass sealing
high temperature alloys
N2 atmosphere
H2 atmosphere
high vacuum
rapid thermal brazing/sealing
