ATV Solutions – Process Based


Discover the latest technological achievements for vacuum reflow systems at ATV Technologie.
Choose from our unique solutions by process or application.
Click on the link to get detailed information on every single product.

Vacuum Soft Soldering / Reflow

  • Formic acid
  • Inert / noble gas
  • Solder paste / flux management
  • H2, N2H2 safety feature 
  • Positive pressure: 0,3 Mpa

Thermal Oxidation / Annealing

  • Wet/dry oxidation
  • High vacuum
  • H2 atmosphere
  • Inert / noble / reactive gas
  • 5 tunable heater zones

Thermo Compression Bonding up to 300°C

  • Transient liquide phase soldering
  • Ag sintering
  • Cu pillar soldering

Vacuum Brazing

  • Glass sealing
  • High temperature alloys
  • N2 atmosphere
  • H2 atmosphere
  • High vacuum
  • Rapid thermal brazing/sealing

Thick film conductor paste firing

  • Pt, Au, AgPd
  • Ag paste / ink firing
  • Resistor paste
  • Dielectric / glass paste
  • Thick copper conductor paste
  • Dry clean air / N2 atmosphere

High Vacuum Enclosing

  • Package sealing with high vacuum encapsulation
  • MEMS Cap / package lid sealing
  • Micro bolometers
  • IR detectors
  • Gyroscopes
  • Thermal getter activation