ideally suitable for DCBs, laser/RF/power die attachment, SiAu alloying, popcorn effect analyzing, wafer bump/flip chip reflow, BCB curing, thermo compression bonding…

Void free soldering without flux or with solder paste is performed in a water cooled blank Al process chamber with viewing window. The process atmospheres can be any like Nitrogen, Argon, pure Hydrogen, Nitrogen enriched with Formic Acid vapor, Vacuum down to < 10-5 mbar, overpressure up to 2 bar or ArH2 plasma. The achievable Oxygen level is ~ 1 ppm. The Nitrogen enriched with Formic Acid atmosphere is ideally to remove any oxides above 150°C on Cupper or Ni surfaces of DCBs without leaving residues and without any device attack. The ArH2 plasma is the best method to remove any organics or oxide prior or during reflow. Ideally for flux less wafer bump reflow.