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• Max. 450ºC,
± 0,2ºK
•
Higher, e.g. 650ºC on request
• Flux less
/ solder paste / void free soldering
• Laser /
RF / power die attachment
• Package
lid sealing
•
Rapid Thermal Photo sensitive
BCB curing
•
AuGe / SiAu alloying, Rapid
Thermal Annealing
•
Thermo compression wafer bonding
• Wafer bump
reflow, flip chip soldering
• Popcorn
effect analyzing
•
Rapid ramping: > 200ºC/min.
on
top of the quarz lamp heated
Al
plate, > 20ºC/second
with direct IR single
wafer heating, ramp down:
~100ºC/minute
with Al Plate and
<20ºC/second without
Al plate
Ramp
rates and hold cycles free
programmable,
precisely controlled
•
Heated areas:
147
x 217, 230 x 217
310
x 240, 450 x 450 mm |
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Wafer bump reflow with SRO-704 under formic acid atmosphere
