• Deposition
of ultra thin films
using ALD Technique
•
Multi-purpose, easily configurable
process chamber
•
Rapid ramping up to 600ºC
• Easily replaceable
process reactor
for different films
Application fields of Atomic
Layer Deposition
• Capacitor dielectrics
- conventional
and high-k materials
•
Gate dielectrics
•
Interconnect applications -
metal barrier
and
seed layer
•
MEMS and MOEMS - coating of
3D and
air-gap structures, interference
filters
Advantages of Atomic Layer Deposition
• Thickness control
on atomic scale
•
100% step coverage in very high
aspect ratios
•
Lowe deposition temperatures
• Wide process
windows
